MECHANIC 3D Middle Layered Reballing Stencil Template for iPhone 12 Pro / 12


R193

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Overview

1. 3D laser square hole BGA reballing stencil template.
2. High-speed numerical control technology and high-temperature resistant toughened materials production, round square precise hole position, make steel net more durable, easier to take off the net, more efficient.
3. Suitable for iPhone 12 Pro / 12 Middle layer motherboard.
4. High temperature resistant synthetic stone made positioning slot.
5. Assisting professionals to do BGA reballing in the most convenient and safest way.

Additional Information

Weight & Size

Weight: 0.033kg
Size: 10cm x 7cm x 2cm

SKU: A0100084989 Category: Tag: Condition: NewOrigin: CN