Kaisi A-13 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 11 / 11 Pro / 11 Pro Max


R143

In Stock at Supplier

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Overview

1. Professional tool for mobile phones repairing.
2. Suitable for iPhone 11 / 11 Pro / 11 Pro Max.
3. The unique holes design makes it easier to take out the formed solder balls.
4. This stencil is easy to use no matter you are a new or expert.
5. Special design enables stencil to align with tinning position of CPU rapidly.
6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.
7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.
8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.
9. Special steel manufacturing, high temperature resistance, no deformation.

Additional Information

General

Compatible with: Apple: iPhone 11 Pro, iPhone 11, iPhone 11 Pro Max

Weight & Size

Weight: 0.028kg
Size: 12cm x 10cm x 1cm

SKU: A0100085094 Category: Tag: Condition: NewOrigin: CN