Kaisi A-12 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone XS Max / XS / XR


R105

In Stock at Supplier

iKhokhaYocoVisaMastercardAmerican ExpressApple PayInstant EFTEFT
Didn't find what you're looking for?
Take a look at these Similar Products or have a look at these Closely Matched Products
Got questions or need assistance?
Please take a look at our Frequently Asked Questions or Contact Us

Overview

1. Professional tool for mobile phones repairing.
2. Suitable for iPhone XS Max / XS / XR.
3. The unique holes design makes it easier to take out the formed solder balls.
4. This stencil is easy to use no matter you are a new or expert.
5. Special design enables stencil to align with tinning position of CPU rapidly.
6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.
7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.
8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.
9. Special steel manufacturing, high temperature resistance, no deformation.

Additional Information

General

Compatible with: Apple: iPhone XS Max, iPhone XR, iPhone XS

Weight & Size

Weight: 0.028kg
Size: 12cm x 10cm x 1cm

SKU: A0100085098 Category: Tag: Condition: NewOrigin: CN