Mijing iPH-13 0.12mm BGA Reballing Stencil Planting for iPhone 11 / 11 Pro / 11 Pro Max


R116

In Stock at Supplier

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Overview

1. Not easy to deform, prevent heating and bulging accurate hole position, one-time molding
2. Good toughness
3. High temperature resistance
4. 0.12mm, make phone repairs easier, make reballing work easier.
5. Heated anti-drum design

Additional Information

Weight & Size

Weight: 0.042kg
Size: 19cm x 10cm x 1cm

SKU: A0100120995 Category: Tag: Condition: NewOrigin: CN