MECHANIC Middle Layered Reballing Stencil Template for iPhone 12 Pro / 12


R247

In Stock at Supplier

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Overview

1. Precise positioning.
2. High-temperature material, not easy to deform no drum pack, no virtual welding.
3. Assisting professionals to do BGA reballing in the most convenient and safest way.
4. Suitable for iPhone 12 Pro / 12 Middle layer motherboard.
5. The strength more durable and not deformed.

Additional Information

Weight & Size

Weight: 0.058kg
Size: 11cm x 8cm x 2cm

SKU: A0100084991 Category: Tag: Condition: NewOrigin: CN