MECHANIC 3D Middle Layered Reballing Stencil Template for iPhone XS MAX


R396

In Stock at Supplier

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Overview

1. 3D laser square hole BGA reballing stencil template.
2. High-speed numerical control technology and high-temperature resistant toughened materials production, round square precise hole position, make steel net more durable, easier to take off the net, more efficient.
3. Suitable for iPhone XS Max Middle layer motherboard.
4. High temperature resistant synthetic stone made positioning slot.
5. Assisting professionals to do BGA reballing in the most convenient and safest way.

Additional Information

Weight & Size

Weight: 0.058kg
Size: 15cm x 11cm x 2cm

SKU: A0100084987 Category: Tag: Condition: NewOrigin: CN